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3216FF1.5-R 1206 Fast Blow SMD Chip Encapsulation Surface Mount Fuses 32VAC DC 1.5A With UL CSA RoHS Reach Approved

Aolittel Technology Co.,Ltd

3216FF1.5-R 1206 Fast Blow SMD Chip Encapsulation Surface Mount Fuses 32VAC DC 1.5A With UL CSA RoHS Reach Approved

Brand Name : Ao littel

Model Number : 12 100 1.5

Certification : UL,CAS,RoHS,Reach

Place of Origin : CHINA

MOQ : 3000 Pieces

Price : Negotiable

Payment Terms : T/T

Supply Ability : 8,000,000 Pieces Per Month

Delivery Time : 10 Workdays

Packaging Details : Tape in reel ,3000 fuses on 8mm tape-and-reel on a 7 inch (178mm) reel per EIA Standard RS481

Name : SMD Chip Encapsulation Surface Mount Fuses

Fuse Type : Fast Blow

Rated Current : 1.5 A

Voltage Rating AC : 32VAC

Voltage Rating DC : 63VDC

Fuse Size / Group : 1206 (3216 metric)

Minimum Operating Temperature : - 65 C

Maximum Operating Temperature : + 125 C

Qualification : AEC-Q200

Packaging : Reel

Length : 3.2 mm

Width : 1.6 mm

Height : 0.75mm

Interrupt Rating : 50 Amps

Factory Pack Quantity : 3000 Pieces

Unit Weight : 0.002116 oz

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3216FF1.5-R 1206 Fast Blow SMD Chip Encapsulation Surface Mount Fuses 32VAC DC 1.5A With UL CSA RoHS Reach Approved


Benefit

Small size with high current ratings
Excellent temperature stability
High reliability and resilience
Strong arc suppression characteristics


Environmental data

• Thermal Shock: MIL-STD-202, Method 107, Test Condition B (-65 °C to +125 °C)
• Vibration: MIL-STD-202, Method 204, Test Condition C (55 Hz - 2 kHz, 10 G)
• Moisture Resistance: MIL-STD-202, Method 106,10 day cycle
• Solderability: ANSI/J-STD-002, Test B
• Additional resistance to solder heat test: MILSTD-202G Method 210F Condition A
• Operating Temperature: -55 ºC to +125 ºC
• AEC-Q200 qualified (250 mA to 7 A)

______________________________________________________________________________3216FF1.5-R 1206 Fast Blow SMD Chip Encapsulation Surface Mount Fuses 32VAC DC 1.5A With UL CSA RoHS Reach Approved Download________


General

Fast-acting fuses help provide overcurrent protection on systems using DC power sources up to 63VDC. The fuse's monolithic,multilayer design provides the highest hold current in the smallest footprint, reduces diffusion-related aging, improves product reliability and resilience, and enhances high temperature
performance. This helps facilitate the development of more reliable, high-performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics.


Features

Multilayer monolithic structure with glass ceramic body and silver fusing element
Silver termination with nickel and pure-tin solder plating,
providing excellent solderability
AEC-Q200 qualified (250 mA to 7 A)
Fast-acting surface mount fuse
Ratings up to 30 amps
Excellent temperature and cycling characteristics
Compatible with reflow and wave solder
RoHS compliant
High temperature performance
-55°C to +125°C operating range


Soldering method

• Wave Immersion: 260 °C, 10 sec max.
• Infrared Reflow: 260 °C, 30 sec max.


Packaging

Package data
Part Number Description
12 100 X 3000 fuses on 8mm tape-and-reel on a 7 inch (178mm) reel per EIA Standard RS481



Application

Circuit Protecting in LCD monitors, PC cards, disk drives, portable communication products, PDAs, digital cameras, DVDs, TVs, cell phones, rechargeable battery packs, battery chargers, etc.


Material Specifications

Construction Body Material Ceramic
Termination Material Silver, Nickel, Tin
Fuse Element Sliver
Terminal Strength

Hanging test:
0603: 0.5kg 30 seconds;
1206 1.5kg, 30 seconds;
0402 part types meet 2-pound push test



Reliability Tests

No. Test Requirement Test Condition Test reference
1 Soldering heat resistance

DCR change ≤±10%
No mechanical damage

One dip at (260±5)℃ for (5±1) sec

MIL-STD-202
Method 210

2 Solderability Minimum 95% coverage One dip at (235±5)℃ for (5±1) sec

MIL-STD-202
Method 208

3 Thermal shock

DCR change ≤±10%
No mechanical damage

1000 cycles between -45 ℃ and +125℃ Refer to Ao littel Standard
4 Moisture resistance

DCR change ≤±15%
No mechanical damage

10 cycles

MIL-STD-202
Method 106

5 Mechanical vibration

DCR change ≤±10%
No mechanical damage

0.4" D.A. or 30 G between 5- 3000 Hz

MIL-STD-202
Method 204

6 Mechanical shock

DCR change ≤±10%
No mechanical damage

Fall from 1 m height of the floor 10 times MIL-STD-202 Method 213
7 Terminal strength

DCR change ≤±10%
No mechanical damage

30 sec. hanging for 1206 (1.0kg) and 0603 (0.5KG) Refer to Ao littel Standard
8 Life No electrical "opens" during testing voltage drop change shall be less than±20% of initial value 80% Rated current ambient temperature +25℃ to +28 ℃,2000 hours Refer to Aolittel Standard
9 Bending No electrical "opens" during testing 2 mm bending ,more than 5 seconds Refer to Ao littel Standard



Cautions and warnings:

1,Handling CHIP FUSE must not be dropped. Chip-offs must not be caused during handling of FUSEs. Components must not be touched with bare hands. Gloves are recommended. Avoid contamination of fuse surface during handling.
2,Soldering Use resin-type flux or non-activated flux. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. Complete removal of flux is recommended.
3,Mounting Electrode must not be scratched before/during/after the mounting process. Contacts and housings used for assembly with fuses have to be clean before mounting. During operation, the fuse’s surface temperature can be very high (ICL). Ensure that adjacent components are placed at a sufficient distance from the fuse to allow for proper cooling of the fuses. Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the fuse. Be sure that surrounding parts and materials can withstand this temperature. Avoid contamination of fuse surface during processing.
4,Operation Use fuses only within the specified operating temperature range. Environmental conditions must not harm the fuses. Use fuses only in normal atmospheric conditions. Contact of chip fuses with any liquids and solvents should be prevented. It must be ensured that no water enters the chip fuse (e.g. through plug terminals). For measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. Galden). Avoid dewing and condensation.


Notice: Specifications of the products displayed herein are subject to change without notice. We assume no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Aolittel's terms and conditions of sale for such products, Aolittel assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Wayon products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. Specifications are subject to change without notice.


Product Tags:

surface mount resettable fuse

      

surface mount thermal fuse

      
Quality 3216FF1.5-R 1206 Fast Blow SMD Chip Encapsulation Surface Mount Fuses 32VAC DC 1.5A With UL CSA RoHS Reach Approved wholesale

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